MISUMI is excited to announce its newest process designed for components used in Semiconductor Manufacturing applications. We now offer three cleaning options for MISUMI products to be used in cleanroom environments.
1 – Degreasing
2 – Precision Cleaning
3 – Electro Polish & Precision Cleaning
We will not only break down the process for each option but also share some images of before and after testing, the Outgas Test Results, and how to select a cleaning option for your MISUMI component.
Option 1: Degreasing
Possible applications include:
- Standard Environment Assembly Machines
- Battery Assembly Line
Step 1 : Degrease & Clean
The component is degreased and cleaned in a hot alkaline cleaner bath.
Step 2: Deionized Water Rinse
The part is then rinsed in ultrasonic deionized water three times.
Step 3: Dry
We dry the part before packaging.
Step 4: Rust-preventive Packing
Lastly, the part is packed in rust-preventive single-layer packing.
Option 2: Precision Cleaning
Possible applications include:
- LCD (Liquid-Crystal Display) Assembly Process
- Battery Assembly Line
- Camera Module Assembly
Step 1 : Degrease & Clean
First, the component is cleaned in a hydrocarbon cleaner with reverse osmosis water and a neutral detergent. Reverse osmosis water is cleaner than the usual filtered water.
Step 2: High-Pressure Water Cleaning
Second, the part is cleaned with high-pressurized reverse osmosis water and then with deionized water (resistivity of 10Mohm cm).
Step 3: High-Temperature Rinsing in Class 1000 Clean Room Environment
Third, the part is rinsed in high-temperature deionized water with a resistivity of 13Mohm cm.
Step 4: Dry in Class 1000 Clean Room Environment
We dry the part before packaging.
Step 5: Degassed Dual Packing in Class 10 Environment
Lastly, the component is packed under a Class 10 working bench.
Option 3: Electro Polish & Precision Clean
Possible Applications include:
- Semiconductor Wafer Fabrication Processes
- LCD Panel Development Process
- OLED (Organic Light-Emitting Diode) Front-End Processes
Step 1 : Degrease & Clean
First, the component is cleaned in a hydrocarbon cleaner with reverse osmosis water and a neutral detergent.
Step 2: Electro Polish
Second, the component is placed in an electro polish bath. There are different electro polish baths designated for different material types.
Step 3: High-Pressure Water Cleaning
Third, the part is cleaned with high-pressurized reverse osmosis water and then with deionized water (resistivity of 10Mohm cm).
Step 4: High-Temperature Rinsing in Class 1000 Clean Room Environment
Fourth, the part is rinsed in high-temperature deionized water with a resistivity of 13Mohm cm.
Step 5: Dry in Class 1000 Clean Room Environment
Fifth, we dry the part before packaging.
Step 6: Degassed Dual Packing in Class 10 Environment
Lastly, the component is packed under a Class 10 working bench.
Clean & Pack Efficiency
To verify the results of each cleaning process, sample components underwent various tests.
Particles and Debris Verification
The above photos are sample photos of a Hex Post (material: SUS304) product tap hole under a Scanning Electron Microscope for visual verification that the part was cleaner after the process.
Particle Count Measurements
| Particle Size | Electro Polish & Precision Clean | Precision Clean | Standard |
| >/= 0.3 | 132,329 | 1,552,658 | 12,527,127 |
| >/= 0.5 | 10,586 | 172,910 | 1,499,727 |
| >/= 0.7 | 3,529 | 45,874 | 423,452 |
| >/= 1.0 | 1,412 | 7,857 | 54,696 |
| >/= 2.0 | 476 | 723 | 4,058 |
The chart above shows and compares particle count measurements of the Deionized water used in the Precision Clean and Electro Polish & Precision Clean cleaning options vs. Standard products.
Outgas Measurements
To further ensure the component is ready for use in Semiconductor Manufacturing application designs, an Outgas test was performed on a Vented Screw (M3, L=10mm, SUS304) using a Thermal Desorption Gas Spectrometry.
Test Conditions: Measurement was taken in vacuum environment from Room Temperature to Approx 400 °C
Outgassed Measurement Comparison between “Precision Cleaning” and “Electro Polish & Precision Cleaning”
In conclusion, the results show that the outgassing of the Vented Screw improved with cleaning option with Electro Polish. Therefore, making the component optimally cleaned for use in cleanroom environments.
How to Choose a Cleaning Option for Your MISUMI Component
MISUMI makes it easy to select your cleaning options. Simply add the appropriate prefix of the cleaning process you’d like listed below to your part number. Remember, there is no minimum order quantity!
| Process | Example Standard Part Number: CBAS6-20 |
| Degreasing | SL-CBAS6-20 |
| Precision Cleaning | SH-CBAS6-20 |
| Electro Polish & Precision Cleaning | SHD-CBAS6-20 |
To learn more about how you can partner with MISUMI in your Semiconductor Manufacturing designs, visit our dedicated page here.
