We will not only break down the process for each option but also share some images of before and after testing, the Outgas Test Results, and how to select a cleaning option for your MISUMI component.<\/p>\n\n\n\n
Option 1: Degreasing<\/strong><\/h2>\n\n\n\nPossible applications include:<\/p>\n\n\n\n
- Standard Environment Assembly Machines<\/li>
- Battery Assembly Line<\/li><\/ul>\n\n\n\n
\n\n![\"\"](\"https:\/\/blog.misumiusa.com\/wp-content\/uploads\/2023\/07\/Degrease-Clean-Pack-Semiconductor-Blog-Hero-and-Process-Images-600x600-1-e1688660844637.png\")
<\/figure><\/div>\n\n\n\nStep 1 <\/strong>: Degrease & Clean<\/strong>
The component is degreased and cleaned in a hot alkaline cleaner bath.<\/p>\n<\/div><\/div>\n\n\n\n\n![\"\"](\"https:\/\/blog.misumiusa.com\/wp-content\/uploads\/2023\/06\/Deionized-Water-Rinse-Clean-Pack-Semiconductor-Blog-Hero-and-Process-Images-600x600-1-e1688137771482.png\")
<\/a><\/figure><\/div>\n\n\n\nStep 2: Deionized Water Rinse<\/strong>
The part is then rinsed in ultrasonic deionized water three times.<\/p>\n<\/div><\/div>\n\n\n\n\n![\"\"](\"https:\/\/blog.misumiusa.com\/wp-content\/uploads\/2023\/06\/Dry-Clean-Pack-Semiconductor-Blog-Hero-and-Process-Images-600x600-1-e1688137892101.png\")
<\/a><\/figure><\/div>\n\n\n\nStep 3: Dry<\/strong>
We dry the part before packaging.<\/p>\n<\/div><\/div>\n\n\n\n\n![\"\"](\"https:\/\/blog.misumiusa.com\/wp-content\/uploads\/2023\/06\/Yellow-bag-Clean-Pack-Semiconductor-Blog-Hero-and-Process-Images-600x600-1.png\")
<\/a><\/figure><\/div>\n\n\n\nStep 4: Rust-preventive Packing<\/strong>
Lastly, the part is packed in rust-preventive single-layer packing.<\/p>\n<\/div><\/div>\n<\/div><\/div><\/section>\n\n\n\n![\"\"](\"https:\/\/blog.misumiusa.com\/wp-content\/uploads\/2023\/07\/Layer-1-Packing-Example.png\")
<\/a>Example of Single Layer Packaging<\/figcaption><\/figure><\/div>\n\n\n\nOption 2: Precision Cleaning<\/strong><\/h2>\n\n\n\nPossible applications include:<\/p>\n\n\n\n
- LCD (Liquid-Crystal Display) Assembly Process<\/li>
- Battery Assembly Line<\/li>
- Camera Module Assembly<\/li><\/ul>\n\n\n\n
\n\n<\/figure><\/div>\n\n\n\nStep 1 : Degrease & Clean<\/strong>
First, the component is cleaned in a hydrocarbon cleaner with reverse osmosis water and a neutral detergent. Reverse osmosis water is cleaner than the usual filtered water.
<\/p>\n<\/div><\/div>\n\n\n\n\n![\"\"](\"https:\/\/blog.misumiusa.com\/wp-content\/uploads\/2023\/06\/Rinse-Clean-Pack-Semiconductor-Blog-Hero-and-Process-Images-600x600-1-e1688137866337.png\")
<\/a><\/figure><\/div>\n\n\n\nStep 2: High-Pressure Water Cleaning<\/strong>
Second, the part is cleaned with high-pressurized reverse osmosis water and then with deionized water (resistivity of 10Mohm cm).
<\/p>\n<\/div><\/div>\n\n\n\n\n<\/a><\/figure><\/div>\n\n\n\nStep 3: High-Temperature Rinsing in Class 1000 Clean Room Environment<\/strong>
Third, the part is rinsed in high-temperature deionized water with a resistivity of 13Mohm cm.
<\/p>\n<\/div><\/div>\n<\/div><\/div><\/section>\n\n\n\n\n\n<\/a><\/figure><\/div>\n\n\n\nStep 4: Dry in Class 1000 Clean Room Environment<\/strong>
We dry the part before packaging.<\/p>\n<\/div><\/div>\n\n\n\n\n![\"\"](\"https:\/\/blog.misumiusa.com\/wp-content\/uploads\/2023\/06\/Blue-bag-Clean-Pack-Semiconductor-Blog-Hero-and-Process-Images-600x600-1.png\")
<\/a><\/figure><\/div>\n\n\n\nStep 5: Degassed Dual Packing in Class 10 Environment<\/strong>
Lastly, the component is packed under a Class 10 working bench.<\/p>\n<\/div><\/div>\n<\/div><\/div><\/section>\n\n\n\nOption 3: Electro Polish & Precision Clean<\/strong><\/h2>\n\n\n\nPossible Applications include:<\/p>\n\n\n\n
- Semiconductor Wafer Fabrication Processes<\/li>
- LCD Panel Development Process<\/li>
- OLED (Organic Light-Emitting Diode) Front-End Processes<\/li><\/ul>\n\n\n\n
\n\n<\/figure><\/div>\n\n\n\nStep 1 : Degrease & Clean<\/strong>
First, the component is cleaned in a hydrocarbon cleaner with reverse osmosis water and a neutral detergent.
<\/p>\n<\/div><\/div>\n\n\n\n\n![\"\"](\"https:\/\/blog.misumiusa.com\/wp-content\/uploads\/2023\/06\/Electro-Clean-Pack-Semiconductor-Blog-Hero-and-Process-Images-600x600-1-e1688137840971.jpg\")
<\/a><\/figure><\/div>\n\n\n\nStep 2: Electro Polish<\/strong>
Second, the component is placed in an electro polish bath. There are different electro polish baths designated for different material types.
<\/p>\n<\/div><\/div>\n\n\n\n\n<\/a><\/figure><\/div>\n\n\n\nStep 3: High-Pressure Water Cleaning<\/strong>
Third, the part is cleaned with high-pressurized reverse osmosis water and then with deionized water (resistivity of 10Mohm cm).
<\/p>\n<\/div><\/div>\n<\/div><\/div><\/section>\n\n\n\n\n\n<\/a><\/figure><\/div>\n\n\n\nStep 4: High-Temperature Rinsing in Class 1000 Clean Room <\/strong>Environment
Fourth, the part is rinsed in high-temperature deionized water with a resistivity of 13Mohm cm.
<\/p>\n<\/div><\/div>\n\n\n\n\n<\/a><\/figure><\/div>\n\n\n\nStep 5: Dry in Class 1000 Clean Room Environment<\/strong><\/p>\n\n\n\nFifth, we dry the part before packaging.<\/p>\n<\/div><\/div>\n\n\n\n
\n<\/a><\/figure><\/div>\n\n\n\nStep 6: Degassed Dual Packing in Class 10 Environment<\/strong>
Lastly, the component is packed under a Class 10 working bench.<\/p>\n<\/div><\/div>\n<\/div><\/div><\/section>\n\n\n\n![\"\"](\"https:\/\/blog.misumiusa.com\/wp-content\/uploads\/2023\/07\/Layer-2-Packing-Example.png\")
<\/a>Example of Dual Packaging<\/figcaption><\/figure><\/div>\n\n\n\nClean & Pack Efficiency<\/strong><\/h2>\n\n\n\nTo verify the results of each cleaning process, sample components underwent various tests.<\/p>\n\n\n\n
Particles and Debris Verification<\/strong><\/h3>\n\n\n\n\n\n![\"\"](\"https:\/\/blog.misumiusa.com\/wp-content\/uploads\/2023\/07\/Before-Cleaning-Semiconductor-Blog.png\")
Before<\/figcaption><\/figure><\/div>\n<\/div><\/div>\n\n\n\n\n![\"\"](\"https:\/\/blog.misumiusa.com\/wp-content\/uploads\/2023\/07\/After-Cleaning-Semiconductor-Blog.png\")
After<\/figcaption><\/figure><\/div>\n<\/div><\/div>\n<\/div><\/div><\/section>\n\n\n\nThe above photos are sample photos of a Hex Post (material: SUS304) product tap hole under a Scanning Electron Microscope for visual verification that the part was cleaner after the process.<\/p>\n\n\n\n
Particle Count Measurements<\/strong><\/h3>\n\n\n\nParticle Size<\/td>
Electro Polish &
Precision Clean<\/td>Precision Clean<\/td> Standard<\/td><\/tr> >\/= 0.3<\/td> 132,329<\/td> 1,552,658<\/td> 12,527,127<\/td><\/tr> >\/= 0.5<\/td> 10,586<\/td> 172,910<\/td> 1,499,727<\/td><\/tr> >\/= 0.7<\/td> 3,529<\/td> 45,874<\/td> 423,452<\/td><\/tr> >\/= 1.0<\/td> 1,412<\/td> 7,857<\/td> 54,696<\/td><\/tr> >\/= 2.0<\/td> 476<\/td> 723<\/td> 4,058<\/td><\/tr><\/tbody><\/table>Sample: SUS304, Count 1 cm^2, For Reference<\/figcaption><\/figure>\n\n\n\nThe chart above shows and compares particle count measurements of the Deionized water used in the Precision Clean and Electro Polish & Precision Clean cleaning options vs. Standard products.<\/p>\n\n\n\n
Outgas Measurements<\/strong><\/h3>\n\n\n\nTo further ensure the component is ready for use in any design, an Outgas test was performed on a Vented Screw (M3, L=10mm, SUS304) using a Thermal Desorption Gas Spectrometry.<\/p>\n\n\n\n
Test Conditions<\/strong>: Measurement was taken in vacuum environment from Room Temperature to Approx 400 \u00b0C<\/p>\n\n\n\n![\"\"](\"https:\/\/blog.misumiusa.com\/wp-content\/uploads\/2023\/07\/Measurement-Pressure-Semiconductor-Outgassed-Graph-1024x569.png\")
Measurement Pressure Graph<\/figcaption><\/figure><\/div>\n\n\n\n![\"\"](\"https:\/\/blog.misumiusa.com\/wp-content\/uploads\/2023\/07\/Sample-Temperature-Semiconductor-Outgassed-Graph.png\")
Sample Temperature<\/figcaption><\/figure><\/div>\n\n\n\nOutgassed Measurement Comparison between \u201cPrecision Cleaning\u201d and \u201cElectro Polish & Precision Cleaning\u201d<\/strong><\/h3>\n\n\n\n![\"\"](\"https:\/\/blog.misumiusa.com\/wp-content\/uploads\/2023\/07\/Test-Results-Gasses-Semiconductor-Outgassed-Graphs-1024x529.png\")
<\/figure><\/div>\n\n\n\nIn conclusion, the results show that the outgassing of the Vented Screw improved with cleaning option with Electro Polish. Therefore, making the component optimally cleaned for use in cleanroom environments.<\/p>\n\n\n\n
How to Choose a Cleaning Option for Your MISUMI Component<\/strong><\/h2>\n\n\n\nMISUMI makes it easy to select your cleaning options. Simply add the appropriate prefix of the cleaning process you\u2019d like listed below to your part number. Remember, there is no minimum order quantity!<\/p>\n\n\n\n
<\/figure><\/div>\n\n\n\nStep 1 <\/strong>: Degrease & Clean<\/strong> Step 2: Deionized Water Rinse<\/strong> Step 3: Dry<\/strong> Step 4: Rust-preventive Packing<\/strong> Possible applications include:<\/p>\n\n\n\n Step 1 : Degrease & Clean<\/strong> Step 2: High-Pressure Water Cleaning<\/strong> Step 3: High-Temperature Rinsing in Class 1000 Clean Room Environment<\/strong> Step 4: Dry in Class 1000 Clean Room Environment<\/strong> Step 5: Degassed Dual Packing in Class 10 Environment<\/strong> Possible Applications include:<\/p>\n\n\n\n Step 1 : Degrease & Clean<\/strong> Step 2: Electro Polish<\/strong> Step 3: High-Pressure Water Cleaning<\/strong> Step 4: High-Temperature Rinsing in Class 1000 Clean Room <\/strong>Environment Step 5: Dry in Class 1000 Clean Room Environment<\/strong><\/p>\n\n\n\n Fifth, we dry the part before packaging.<\/p>\n<\/div><\/div>\n\n\n\n Step 6: Degassed Dual Packing in Class 10 Environment<\/strong> To verify the results of each cleaning process, sample components underwent various tests.<\/p>\n\n\n\n The above photos are sample photos of a Hex Post (material: SUS304) product tap hole under a Scanning Electron Microscope for visual verification that the part was cleaner after the process.<\/p>\n\n\n\n The chart above shows and compares particle count measurements of the Deionized water used in the Precision Clean and Electro Polish & Precision Clean cleaning options vs. Standard products.<\/p>\n\n\n\n To further ensure the component is ready for use in any design, an Outgas test was performed on a Vented Screw (M3, L=10mm, SUS304) using a Thermal Desorption Gas Spectrometry.<\/p>\n\n\n\n Test Conditions<\/strong>: Measurement was taken in vacuum environment from Room Temperature to Approx 400 \u00b0C<\/p>\n\n\n\n In conclusion, the results show that the outgassing of the Vented Screw improved with cleaning option with Electro Polish. Therefore, making the component optimally cleaned for use in cleanroom environments.<\/p>\n\n\n\n MISUMI makes it easy to select your cleaning options. Simply add the appropriate prefix of the cleaning process you\u2019d like listed below to your part number. Remember, there is no minimum order quantity!<\/p>\n\n\n\n
The component is degreased and cleaned in a hot alkaline cleaner bath.<\/p>\n<\/div><\/div>\n\n\n\n<\/a><\/figure><\/div>\n\n\n\n
The part is then rinsed in ultrasonic deionized water three times.<\/p>\n<\/div><\/div>\n\n\n\n<\/a><\/figure><\/div>\n\n\n\n
We dry the part before packaging.<\/p>\n<\/div><\/div>\n\n\n\n<\/a><\/figure><\/div>\n\n\n\n
Lastly, the part is packed in rust-preventive single-layer packing.<\/p>\n<\/div><\/div>\n<\/div><\/div><\/section>\n\n\n\n<\/a>Option 2: Precision Cleaning<\/strong><\/h2>\n\n\n\n
<\/figure><\/div>\n\n\n\n
First, the component is cleaned in a hydrocarbon cleaner with reverse osmosis water and a neutral detergent. Reverse osmosis water is cleaner than the usual filtered water.
<\/p>\n<\/div><\/div>\n\n\n\n<\/a><\/figure><\/div>\n\n\n\n
Second, the part is cleaned with high-pressurized reverse osmosis water and then with deionized water (resistivity of 10Mohm cm).
<\/p>\n<\/div><\/div>\n\n\n\n<\/a><\/figure><\/div>\n\n\n\n
Third, the part is rinsed in high-temperature deionized water with a resistivity of 13Mohm cm.
<\/p>\n<\/div><\/div>\n<\/div><\/div><\/section>\n\n\n\n<\/a><\/figure><\/div>\n\n\n\n
We dry the part before packaging.<\/p>\n<\/div><\/div>\n\n\n\n<\/a><\/figure><\/div>\n\n\n\n
Lastly, the component is packed under a Class 10 working bench.<\/p>\n<\/div><\/div>\n<\/div><\/div><\/section>\n\n\n\nOption 3: Electro Polish & Precision Clean<\/strong><\/h2>\n\n\n\n
<\/figure><\/div>\n\n\n\n
First, the component is cleaned in a hydrocarbon cleaner with reverse osmosis water and a neutral detergent.
<\/p>\n<\/div><\/div>\n\n\n\n<\/a><\/figure><\/div>\n\n\n\n
Second, the component is placed in an electro polish bath. There are different electro polish baths designated for different material types.
<\/p>\n<\/div><\/div>\n\n\n\n<\/a><\/figure><\/div>\n\n\n\n
Third, the part is cleaned with high-pressurized reverse osmosis water and then with deionized water (resistivity of 10Mohm cm).
<\/p>\n<\/div><\/div>\n<\/div><\/div><\/section>\n\n\n\n<\/a><\/figure><\/div>\n\n\n\n
Fourth, the part is rinsed in high-temperature deionized water with a resistivity of 13Mohm cm.
<\/p>\n<\/div><\/div>\n\n\n\n<\/a><\/figure><\/div>\n\n\n\n<\/a><\/figure><\/div>\n\n\n\n
Lastly, the component is packed under a Class 10 working bench.<\/p>\n<\/div><\/div>\n<\/div><\/div><\/section>\n\n\n\n<\/a>Clean & Pack Efficiency<\/strong><\/h2>\n\n\n\n
Particles and Debris Verification<\/strong><\/h3>\n\n\n\n
Particle Count Measurements<\/strong><\/h3>\n\n\n\n
Particle Size<\/td>
Electro Polish &
Precision Clean<\/td>Precision Clean<\/td> Standard<\/td><\/tr> >\/= 0.3<\/td> 132,329<\/td> 1,552,658<\/td> 12,527,127<\/td><\/tr> >\/= 0.5<\/td> 10,586<\/td> 172,910<\/td> 1,499,727<\/td><\/tr> >\/= 0.7<\/td> 3,529<\/td> 45,874<\/td> 423,452<\/td><\/tr> >\/= 1.0<\/td> 1,412<\/td> 7,857<\/td> 54,696<\/td><\/tr> >\/= 2.0<\/td> 476<\/td> 723<\/td> 4,058<\/td><\/tr><\/tbody><\/table> Outgas Measurements<\/strong><\/h3>\n\n\n\n
Outgassed Measurement Comparison between \u201cPrecision Cleaning\u201d and \u201cElectro Polish & Precision Cleaning\u201d<\/strong><\/h3>\n\n\n\n
<\/figure><\/div>\n\n\n\nHow to Choose a Cleaning Option for Your MISUMI Component<\/strong><\/h2>\n\n\n\n