Bernoulli Chuck, BC Series, Flat Placement, 300 Microns or Less

Bernoulli Chuck, BC Series, Flat Placement, 300 Microns or Less

Can be transported with the wafer center in a disengaged state.

· The guide stopper and the wafer are the points that are in contact.
· A wafer is set inside the 4 guide ring white pins, a wafer is set inside the four start button guide ring white pins, and the start button is secured, thus enabling transport in a disengaged state.
· Can be extend from 2 inches to 12 inches by selecting handles at three inclinations, 20, 45, and 90 degrees, and changing the appropriate guide ring (available inclinations are fixed, and you have to change the body to change the inclination used.).
• The guide stopper is gently tapered so that it contacts the wafer edge at a point.
• Guide rings used in transparent acrylic resin as an ESD countermeasures enable positioning and suction state to be checked visually.
• Use of conductive nylon resin for the main body achieves weight reduction.
• Able to support wafers with patterns printed on both faces that are 50 μm thin and difficult to handle.
• Is also compatible with special design parts in conjunction with square shape etc. objects.
• A button or lever can be selected for the switch.

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Part NumberVolume DiscountDays to Ship RoHSAdaptive Wafer Size
Operating Angle

27 Days or more


27 Days or more


27 Days or more


27 Days or more


27 Days or more


27 Days or more



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Basic Information

Types Bernoulli chuck Application Wafer Transport Components Main Body+Components
Features Electrical Conductivity Body Material Conductive Nylon Main Body + Component Parts Details With Tube

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